CPU: MediaTek MT6853 Dimensity 720
Architecture: 2X ARM Cortex-A76 up to 2.0GHz + 6X ARM Cortex-A55 up to 2.0GHz
OS : Andriod 11.0
Memory : 4GB+64GB/6GB+128GB
Display : FHD+ support (1080X2520)
Camera : 64 million
Network support : 2G/3G/4G/5G full network access
Wireless connectivity: WiFi/Bluetooth/GPS/Beidou
NPU: 1T computing power
Product introduction
XY6853A is a 5G AI smart module based on MTK’s MT6853 (MediaTek Dimensity 720) platform, industrial-grade high-performance, running Android 11.0 operating system, supporting NR-SA/NR-NSA/LTE-FDD(CAT-18)/LTE-TDD(CAT-18)/WCDMA/ TDSCDMA/EVDO/CDMA/GSM, etc.; support WiFi 5 802.11 a/b/g/n/ac, BT v2.1+EDR, 3.0+HS,v4.1+HS,V5.1, support Beidou(BeiDou),Galileo,Glonass,GPS,QZSS satellite positioning; have Multiple audio and video input/output interfaces and rich GPIO interfaces.
| Type | Network band |
| NR-SA | N1/N41/N77/N78/N79 |
| NR-NSA | N78+B1/B3/B5/B8,N79+B3/B39,N41+B3/B39 |
| LTE-FDD | B1/B3/B5/B8 |
| LTE-TDD | B34/B38/B39/B40/B41 |
| WCDMA | B1/B5/B8 |
| TD-SCDMA | B34/B39 |
| EVDO/CDMA | BC0 |
| GSM | B3/B5/B8 |
| DL CCA | B1/B3/B38/B39/B40/B41 |
| DL NCCA | B3/B40/B41 |
| Inter CA | B1+B3 B3+B5 B1+B5 B39+B41 |
| UL CCA | B3/B38/B39/B40/B41 |
| WiFi 802.11a/b/g/n/ac | 2400～2483.5MHz/5725～5850MHz/5925MHz |
| BT V2.1+EDR，3.0+HS,V4.2+HS，BT5.1 | 2400～2483.5MHz |
| GNSS | Beidou（北斗）,Galileo,Glonass,GPS,QZSS |
*Note: The frequency band is subject to specific shipment.
MT6853 is a chip module with 184LCC+237LGA pins. With a size of only 50.0mm × 50.0mm × 2.65mm, it can be embedded in various M2M product applications via solder pads and is ideal for developing mobile devices such as car computers, multimedia terminals, smart home, IoT terminals, etc.
Note
1.DL CCA: Downlink Intra-band Contiguous Carrier Aggregation
2.DL NCCA: Downlink Intra-band No-Contiguous Carrier Aggregation Downlink Intra-band Non-Contiguous Carrier Aggregation
3.Inter CA: Inter band Carrier Aggregation Inter-band Carrier Aggregation
4.UL CCA: Uplink Intra-band Contiguous Carrier Aggregation Uplink Intra-band Contiguous Carrier Aggregation
Main performance parameters
| Process | 7nm |
| Application Processors | 2xCortex-A76up to 2.0GHz + 6xCortex-A55 up to 2.0GHz |
| GPU | Arm Mali-G57 MC3 Open CL 2.2 |
| Camera interface | 4xMIPI CSI（4 Data lanes）64MP @ 30fps |
| video decode | 4K 30fps H.264/H.265/VP9 |
| video encode | 4K 30fps H.264/H.265 |
| LCM interface | MIPI DSI (4 Data lanes) highest resolution support FHD+ (1080×2520@90Hz) |
| AI Accelerator | Up to 1TOPs (1 trillion operations per second) |
| Performance | Description |
| Modem Processor | 2MDSPRVSS processor ARM maximum frequency 416MHz |
| Electricity supply | VBAT supply voltage range: 3.5V~4.35V Typical supply voltage: 4.2V |
| Transmitting power | Class4(33dBm±2Db)forGSM850/GSM900 Class1(30dBm±2Db)forDCS1800/PCS1900 ClassE2(27dBm±3Db)forEGSM900/GSM8508PSK ClassE2(26dBm±3Db)forDCS1800/PCS19008PSK Class3(24dBm+l/-3Db)forWCDMAbands Class3(24dBm+l/-3Db)forCDMABCO Class3(24dBm+l/-3Db)forTD-SCDMAB34/B39 Class3(23dBm±2.7Db)forLTEFDDbands Class3(23dBm±2.7Db)forLTETDDbands Class3(23dBm±2.7Db)forNRSAbands Class3(23dBm±2.7Db)forNRNSAbands |
| NR Characteristics | Support 3GPPR153.5GbpsDL/775MbpsUL Support 5-100MHz RF bandwidth Support downlink 4x4MIM0,uplink 2x2MIM0 SA:Max2.3Gbps(DL),625Mbps(UL) NSA:Max3.5Gbps(DL),775Mbps(UL) |
| LTE Features | Support 3GPPRllLTECAT-18DL/CAT-13UL Support 1.4-20MHz RF bandwidth Support downlink 4x4MIM0 FDD:Max1.2Gbps(DL),150Mbps(UL) TDD:Max1.2Gbps(DL),150Mbps(UL) |
| WCDMA Features | Support 3GPPR9DC-HSPA+ Support 16-QAM,64-QAMandQPSKmodulation 3GPPR6HSUPA:Max11.5Mbps(UL) 3GPPR8DC-HSPA+:Max42.2Mbps(DL) |
| TD-SC Swirl A Features | Support 3GPPR81.28TDD TD-HSDPA:MAX2.8Mbps(DL) TD-HSUPA:MAX2.2Mbps(UL) |
| CDMA Features | Max3.1Mbps(DL),1.8Mbps(UL) |
| GSM/GPRS/EDGE features | GPRS: Support GPRSmulti-slotclass12 Coding format: CS-1, CS-2, CS-3 and CS-4 Maximum 4 Rx time slots per frame |
| GSM/GPRS/EDGE features | EDGE: Support EDGEmulti-slotclass12 Support GMSK and 8PSK Encoding format: CS1-4 and MCS1-9 |
| WLAN features | 2.4GHz/5GHz dual band, support 802.lla/b/g/n/ac, support AP mode |
| Bluetooth features | BTv2.1+EDR,3.0+HS,v4.1+HS,V5.1(LowEnergy) |
| Satellite positioning | Beidou,Galileo,Glonass,GPS,QZSS |
| EMMC/UFS | Support up to UFS2.1,256GByte. |
| DDR | Supports up to 12GByte@2channels16bitxLPDDR4X4266MHz |
| SMS | Text with PDU mode |
| Point-to-point MO and MTSMS broadcast SMS storage: default SIM | |
| AT command | Not supported |
| Audio Interface | Audio input: 4 groups of analog microphone input 1 way as headphones MIC input, one way main MIC, Voicewakeup, the other two noise reduction MIC audio output: Class AB stereo headphone output Class AB differential earpiece output Class AB differential output to external audio amplifier |
| USB Interface | Support USB3.0Device mode, data transfer rate up to 5.OGbps, for software debugging and software upgrades, etc. Support USB2.0OTG |
| USIM card interface | 2 groups of USIM/SIM card interface, support USIM/SIM card: 1.8V and 3V support dual SIM card dual standby |
| SDIO Interface | Support SD/SDHC/MS/MSPR0/MMC/SDI02.0or3.04bitSDIO,8bitSDIO Support hot-swapping |
| I2C Interface | 8 groups of I2C, the highest rate up to 400K, when using I2C DMA can reach a maximum speed of 3.4Mbps, for TP, Camera>Sensor and other peripherals |
| SPI Interface | 3 groups of SPI interface, up to 27Mbit/s, support DMAmode. |
| ADC Interface | Quad, for general purpose 12bit ADC,Inputrange=0.05~l.45V |
| Antenna Interface | 7 RF antennas, WIFI/BT antennas, GNSS antennas, FMRX antenna interface |
| Physical Characteristics | Size: 50±0.15×50±0.15×2.8±0.2mm Interface: 184LCC+169LGA Warpage: <0.3mm Weight: 10.9g |
| Temperature range | Normal operating temperature: -20°C to +70°C Extreme operating temperature: -25°C and +80°C1) Storage temperature: -40°C to +85°C |
| Software Upgrade | via USB |
| RoHS | RoHS compliant |